SubsidieMeestersSilicon-Rich Materials for Advanced Semiconductor Fabrication
The project aims to develop advanced inorganic materials for Extreme Ultraviolet lithography to enhance semiconductor chip performance and capture a significant market share in photoresist materials.
Projectdetails
Introduction
Semiconductor chips empower all modern digital technology and are an integral part of our lives. Only a handful of companies can produce them in their advanced forms or equipment and materials for the nanometer-scale precision required for their manufacture.
Importance of EUV Lithography
To further improve semiconductor chips' performance, a process called Extreme Ultraviolet lithography (EUVL) is required. PiBond is one of two companies globally that have innovated inorganic EUVL materials meeting future needs.
Challenges in Material Development
The development of materials that enable the formulation of chip structures below the 3nm node is extremely challenging. It requires:
- Extreme molecular material control
- Outstanding quality
There is a myriad of challenges to overcome for a successful material and process.
Market Potential
This high-risk project enables us to unlock a significant portion of the advanced chips market of >500Bn and SAM of >3Bn in photoresist materials.
Strategic Importance
Our project is critical for the EU goals in semiconductor manufacturing (Chips Act).
Financiële details & Tijdlijn
Financiële details
| Subsidiebedrag | € 2.487.240 |
| Totale projectbegroting | € 3.553.200 |
Tijdlijn
| Startdatum | 1-8-2023 |
| Einddatum | 31-7-2025 |
| Subsidiejaar | 2023 |
Partners & Locaties
Projectpartners
- PIBOND OYpenvoerder
- Pibond GmbH
- Pibond GmbH
Land(en)
Vergelijkbare projecten binnen EIC Accelerator
| Project | Regeling | Bedrag | Jaar | Actie |
|---|---|---|---|---|
A cutting-edge digital dispensing system for next-gen electronics manufacturingThe io600 system revolutionizes semiconductor packaging with eco-friendly, high-resolution material deposition, enabling smaller, more powerful chips and supporting sustainability in the industry. | EIC Accelerator | € 2.457.875 | 2024 | Details |
Developing First-in-Class Diamond-based Quantum Microscopy for immediate semiconductor industry applicationsQuantumDiamonds is developing a Super-resolution Quantum Imager for the semiconductor industry to achieve sub-100 nm imaging resolution and rapid diagnostics for chip defects, aiming for commercialization. | EIC Accelerator | € 2.475.229 | 2024 | Details |
Optimisation of a novel software tool for automation of the design & verification process of semiconductor developmentLUBIS EDA is developing software to automate chip design and verification, ensuring error-free production, faster market entry, and increased revenue for semiconductor developers. | EIC Accelerator | € 2.499.999 | 2024 | Details |
The first-ever mask-based technology for faster, precise, and sustainable printing of 3D interconnects for the display and semiconductor packaging industry.Fonontech aims to revolutionize semiconductor packaging with its patented Impulse Printing technology, achieving high scalability and precision to drive significant industry growth by 2030. | EIC Accelerator | € 2.445.035 | 2025 | Details |
A cutting-edge digital dispensing system for next-gen electronics manufacturing
The io600 system revolutionizes semiconductor packaging with eco-friendly, high-resolution material deposition, enabling smaller, more powerful chips and supporting sustainability in the industry.
Developing First-in-Class Diamond-based Quantum Microscopy for immediate semiconductor industry applications
QuantumDiamonds is developing a Super-resolution Quantum Imager for the semiconductor industry to achieve sub-100 nm imaging resolution and rapid diagnostics for chip defects, aiming for commercialization.
Optimisation of a novel software tool for automation of the design & verification process of semiconductor development
LUBIS EDA is developing software to automate chip design and verification, ensuring error-free production, faster market entry, and increased revenue for semiconductor developers.
The first-ever mask-based technology for faster, precise, and sustainable printing of 3D interconnects for the display and semiconductor packaging industry.
Fonontech aims to revolutionize semiconductor packaging with its patented Impulse Printing technology, achieving high scalability and precision to drive significant industry growth by 2030.
Vergelijkbare projecten uit andere regelingen
| Project | Regeling | Bedrag | Jaar | Actie |
|---|---|---|---|---|
Dispersion force masked-based helium atom lithographyThe FabouLACE project aims to develop a disruptive lithography technology using metastable atoms to achieve 2 nm chip features, enhancing performance and enabling new markets by 2031. | EIC Transition | € 2.499.397 | 2023 | Details |
Next-Generation Light Source: Driving plasmas to power tomorrow’s nanolithographyMOORELIGHT aims to enhance EUV light source efficiency for semiconductor production by optimizing solid-state laser interactions with tailored tin targets and advancing plasma modeling. | ERC Consolid... | € 2.000.000 | 2024 | Details |
Kathodeluminescentie microscopie voor halfgeleider analyseDelmic onderzoekt de haalbaarheid van innovatieve Kathodeluminescentie microscopie voor geavanceerde inspectie van complexe halfgeleiders om defecten en vertragingen te verminderen. | Mkb-innovati... | € 20.000 | 2021 | Details |
Super-resolution microscopy for semiconductor metrologyThe MICROSEM project aims to develop a super-resolution microscopy technique using high-harmonic generation for sub-100 nm imaging in semiconductors, enhancing metrology without labeling. | ERC Proof of... | € 150.000 | 2024 | Details |
Enabling spatially-resolved mapping of electric activity in operational devices at atomic-resolutionThe project aims to develop a novel technique for operando electron beam-induced current imaging in RRAM devices, enabling real-time visualization of electrical activity at atomic resolution. | ERC Consolid... | € 2.082.500 | 2024 | Details |
Dispersion force masked-based helium atom lithography
The FabouLACE project aims to develop a disruptive lithography technology using metastable atoms to achieve 2 nm chip features, enhancing performance and enabling new markets by 2031.
Next-Generation Light Source: Driving plasmas to power tomorrow’s nanolithography
MOORELIGHT aims to enhance EUV light source efficiency for semiconductor production by optimizing solid-state laser interactions with tailored tin targets and advancing plasma modeling.
Kathodeluminescentie microscopie voor halfgeleider analyse
Delmic onderzoekt de haalbaarheid van innovatieve Kathodeluminescentie microscopie voor geavanceerde inspectie van complexe halfgeleiders om defecten en vertragingen te verminderen.
Super-resolution microscopy for semiconductor metrology
The MICROSEM project aims to develop a super-resolution microscopy technique using high-harmonic generation for sub-100 nm imaging in semiconductors, enhancing metrology without labeling.
Enabling spatially-resolved mapping of electric activity in operational devices at atomic-resolution
The project aims to develop a novel technique for operando electron beam-induced current imaging in RRAM devices, enabling real-time visualization of electrical activity at atomic resolution.