A cutting-edge digital dispensing system for next-gen electronics manufacturing

Introduction

The semiconductor industry is aiming at producing smaller and more powerful chips. However, semiconductor packaging (back-end) technologies have reached their limits in terms of material deposition.

Current Challenges

Backend solutions for material deposition are:

1. Subtractive technologies - etching and electroplating - which are highly polluting and, thus, unsustainable.
2. Additive Manufacturing techniques - these have reached their resolution limit considering the material fillers and/or viscosity, making it impossible to achieve smaller packaging and thus smaller chips.

Our Solution

Our solution is the io600 system. It uses the CLAD (Continuous Laser-Assisted Deposition) technology to deliver high-volume deposition of any material on any kind of substrate, at a high throughput, highest resolution, and without employing polluting materials.

Advantages of Io600

Io600 is a game changer in the semiconductor backend process with:

• Times higher viscosity than inkjet without any risk of clogging.
• 50% to 100% higher resolution compared to screen printers, jetters, and needle dispensers.
• 35 times faster than dispensing systems.
• Smaller KOZ means higher packaging density (10% die-density improvement).
• 40% lower CAPEX.
• Less clean room space (80% lower area).
• Does not employ hazardous chemicals and saves 1 m³ of water per m² in PCB manufacturing.

Target Customers

IO600 customers are semiconductor packaging companies. They will benefit from:

• Improved resolution.
• Higher throughput.
• Lower CAPEX.
• The potential for reshoring the back-end process to the US and Europe due to its non-polluting process.

End Users

Io600 users of the chips built with io600 systems are electronic equipment manufacturers, which will design smaller, more powerful chips, key in electronics.

Alignment with Strategic Policies

Io600 aligns with EU strategic policies on:

• Green Deal and sustainability
• Digital transformation (better chip designs)
• EU Chips Act - allows reshoring of the backend process and bolsters Europe’s competitiveness and resilience in semiconductor technologies.