Dispersion force masked-based helium atom lithography
The FabouLACE project aims to develop a disruptive lithography technology using metastable atoms to achieve 2 nm chip features, enhancing performance and enabling new markets by 2031.
Projectdetails
As Margrethe Vestager, European Commission Executive Vice-President, said “There is no ‘digital’ without chips”.
Introduction
Leading-edge semiconductors provide the foundation of the digitalization of entire sectors and industries that are transforming the EU economy and of emerging technologies such as artificial intelligence and quantum computing.
Photolithography Challenges
Photolithography is currently used for the initial patterning step of chip manufacturing, and leading-edge chips require smaller and smaller features. The smallest features that can be produced with this technology (26 nm at present and expected to reach 16 nm in 2028) not only limit the performance and power efficiency of leading-edge chips but also the opening of new markets linked to quantum devices and silicon devices with integrated light sources.
FabouLACE Project
FabouLACE project catches this opportunity through a disruptive lithography approach that uses metastable atoms and dispersion force-based masks and enables features of 2 nm.
Current Stage and Development
The technology, currently at proof of concept stage and protected by two patents, will be brought to TRL 6 by the end of the project by developing a prototype. Its performances will be validated together with Imec (a key actor in the development, testing, and early adoption of nano- and digital technology innovations, including lithography) and end-users in the markets of interest.
Market Introduction
The spin-off Lace, founded in 2022, will bring the technology to the market by 2031. The technology has already attracted significant interest among investors, raising 450k€ in a few months, and among the major foundry Intel, which accepted Lace into its highly competitive start-up program, Intel Ignite.
Business Readiness
Market and business readiness will be developed together with end-users, leveraging the economic support from investors, with over 3M€ in private funding expected to be attracted by 2026.
Financial Projections
The technological and business maturation is expected to result in as much as 628M€ in revenue in the 2031-2036 period.
Conclusion
Let the quantum future begin.
Financiële details & Tijdlijn
Financiële details
Subsidiebedrag | € 2.499.397 |
Totale projectbegroting | € 2.499.397 |
Tijdlijn
Startdatum | 1-12-2023 |
Einddatum | 30-11-2026 |
Subsidiejaar | 2023 |
Partners & Locaties
Projectpartners
- LACE LITHOGRAPHY ASpenvoerder
- INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Land(en)
Vergelijkbare projecten binnen EIC Transition
Project | Regeling | Bedrag | Jaar | Actie |
---|---|---|---|---|
Laser digital transfer of 2D materials enabled photonics: from the lab 2 the fabThe L2D2 project aims to develop a green, scalable technology for growing and integrating high-quality graphene and 2D materials onto silicon substrates, enabling industrial applications and commercialization. | EIC Transition | € 2.499.975 | 2022 | Details |
Nano-imprint lithography of titania-based metaopticsMETAPRINT aims to revolutionize AR smart-glasses by using nano-imprint lithography for efficient, cost-effective production of advanced photonic metasurfaces that enhance display performance. | EIC Transition | € 2.473.250 | 2025 | Details |
Advanced lasers for quantum technologiesAQLAS aims to develop an affordable, compact laser module for quantum computers, enhancing performance and accessibility while establishing a sustainable quantum industry in Europe. | EIC Transition | € 2.483.740 | 2024 | Details |
Microcomb Photonic EngineM-ENGINE aims to revolutionize data center bandwidth with a scalable photonic chip solution using optical frequency combs, reducing energy consumption and enhancing transmission capacity. | EIC Transition | € 2.499.445 | 2023 | Details |
Germanium quantum processors: more, robust, availableGroove aims to develop scalable germanium-based qubits for quantum computing, achieving 16 qubits for cloud access while preparing a start-up to meet market demands and advance the EU's quantum ambitions. | EIC Transition | € 2.499.999 | 2023 | Details |
Laser digital transfer of 2D materials enabled photonics: from the lab 2 the fab
The L2D2 project aims to develop a green, scalable technology for growing and integrating high-quality graphene and 2D materials onto silicon substrates, enabling industrial applications and commercialization.
Nano-imprint lithography of titania-based metaoptics
METAPRINT aims to revolutionize AR smart-glasses by using nano-imprint lithography for efficient, cost-effective production of advanced photonic metasurfaces that enhance display performance.
Advanced lasers for quantum technologies
AQLAS aims to develop an affordable, compact laser module for quantum computers, enhancing performance and accessibility while establishing a sustainable quantum industry in Europe.
Microcomb Photonic Engine
M-ENGINE aims to revolutionize data center bandwidth with a scalable photonic chip solution using optical frequency combs, reducing energy consumption and enhancing transmission capacity.
Germanium quantum processors: more, robust, available
Groove aims to develop scalable germanium-based qubits for quantum computing, achieving 16 qubits for cloud access while preparing a start-up to meet market demands and advance the EU's quantum ambitions.
Vergelijkbare projecten uit andere regelingen
Project | Regeling | Bedrag | Jaar | Actie |
---|---|---|---|---|
A cutting-edge digital dispensing system for next-gen electronics manufacturingThe io600 system revolutionizes semiconductor packaging with eco-friendly, high-resolution material deposition, enabling smaller, more powerful chips and supporting sustainability in the industry. | EIC Accelerator | € 2.457.875 | 2024 | Details |
Integrated photonic circuit fabrication by femtosecond laser writing for quantum informationThe PhotonFAB project aims to enhance the production of integrated photonic devices for quantum applications using femtosecond laser writing, targeting commercial viability and market expansion. | ERC Proof of... | € 150.000 | 2022 | Details |
Silicon-Rich Materials for Advanced Semiconductor FabricationThe project aims to develop advanced inorganic materials for Extreme Ultraviolet lithography to enhance semiconductor chip performance and capture a significant market share in photoresist materials. | EIC Accelerator | € 2.487.240 | 2023 | Details |
The first-ever mask-based technology for faster, precise, and sustainable printing of 3D interconnects for the display and semiconductor packaging industry.Fonontech aims to revolutionize semiconductor packaging with its patented Impulse Printing technology, achieving high scalability and precision to drive significant industry growth by 2030. | EIC Accelerator | € 2.445.035 | 2025 | Details |
Next-Generation Light Source: Driving plasmas to power tomorrow’s nanolithographyMOORELIGHT aims to enhance EUV light source efficiency for semiconductor production by optimizing solid-state laser interactions with tailored tin targets and advancing plasma modeling. | ERC Consolid... | € 2.000.000 | 2024 | Details |
A cutting-edge digital dispensing system for next-gen electronics manufacturing
The io600 system revolutionizes semiconductor packaging with eco-friendly, high-resolution material deposition, enabling smaller, more powerful chips and supporting sustainability in the industry.
Integrated photonic circuit fabrication by femtosecond laser writing for quantum information
The PhotonFAB project aims to enhance the production of integrated photonic devices for quantum applications using femtosecond laser writing, targeting commercial viability and market expansion.
Silicon-Rich Materials for Advanced Semiconductor Fabrication
The project aims to develop advanced inorganic materials for Extreme Ultraviolet lithography to enhance semiconductor chip performance and capture a significant market share in photoresist materials.
The first-ever mask-based technology for faster, precise, and sustainable printing of 3D interconnects for the display and semiconductor packaging industry.
Fonontech aims to revolutionize semiconductor packaging with its patented Impulse Printing technology, achieving high scalability and precision to drive significant industry growth by 2030.
Next-Generation Light Source: Driving plasmas to power tomorrow’s nanolithography
MOORELIGHT aims to enhance EUV light source efficiency for semiconductor production by optimizing solid-state laser interactions with tailored tin targets and advancing plasma modeling.