The first-ever mask-based technology for faster, precise, and sustainable printing of 3D interconnects for the display and semiconductor packaging industry.

Introduction

At Fonontech, our vision is to pioneer a transformative and sustainable era in the semiconductor packaging industry through our proprietary cutting-edge technology, Impulse Printing.

Technology Background

Originating from extensive research and development at the Dutch leading Applied Research Institute TNO, the Impulse Printing technology has the unprecedented scalability, accuracy, and throughput for both 2D and 3D interconnect printing for the billion-dollar semiconductor and micro-LED packaging industry.

Features and Benefits

The technology can attain feature sizes ranging from:

• <10 µm to >100 µm in 3D
• The highest throughput and lowest cost of ownership

This provides a major competitive edge, particularly in the critical lower feature range essential for enabling product miniaturization.

Competitive Advantage

Impulse Printing, distinguished by minimal cost of ownership and facility footprint, is safeguarded by 14 patents.

Market Strategy

It is slated for direct sales to high-volume electronic device manufacturers or through system integrators, securing the company a revenue of €533 M by 2030.