SubsidieMeestersLaser digital transfer of 2D materials enabled photonics: from the lab 2 the fab
The L2D2 project aims to develop a green, scalable technology for growing and integrating high-quality graphene and 2D materials onto silicon substrates, enabling industrial applications and commercialization.
Projectdetails
Introduction
To unveil the true potential of graphene and 2D materials and address the increasing demand for industrial applications, it is essential to develop upscaling growth technologies which preserve the pristine quality at large wafer size and enable the wafer-scale integration of the material with a standardized process.
Technological Breakthrough
Therefore, a green and solvent-free technology offering the solution to transfer single layer graphene and 2D materials in a single step, preserving the same quality in wafer scale processing constitutes a major breakthrough, with the potential to disrupt all the market segments associated with the emerging applications.
Project Overview
This project, L2D2, builds upon the IP generated within the H2020-FET-open project LEAF-2D, to deliver the first scalable digital process for growing and integrating graphene (Gr) and the most prominent 2D materials (including MoTe2 and WS2) in terms of optoelectronic properties, quality, and uniformity, onto Si photonics and CMOS compatible substrates on-demand.
Objectives
In particular, L2D2 will deliver a two-fold technological breakthrough:
- The technology to upscale Gr and other 2D materials on the 8-inch scale at industrial grade quality.
- A laser-based, single-step and green printing solution for wafer-scale integration of 2D materials.
Business Model
The exploitable outcomes of L2D2 will lay the foundation for a deep-tech business model which will secure the foreground of the project and transform it to innovations with high exploitation potential.
Spin-Out Creation
The business model will be realized through the creation of a spin-out with a team of co-founders encompassing highly skilled entrepreneurs with equal expertise in technology, innovation, and business. The spin-out will follow a viable and fast commercialization pathway, relying on strategic corporate agreements with the world leading companies in Graphene and Si photonics, as well as on IP exploitation.
Financiële details & Tijdlijn
Financiële details
| Subsidiebedrag | € 2.499.975 |
| Totale projectbegroting | € 2.499.975 |
Tijdlijn
| Startdatum | 1-10-2022 |
| Einddatum | 30-9-2025 |
| Subsidiejaar | 2022 |
Partners & Locaties
Projectpartners
- ETHNICON METSOVION POLYTECHNIONpenvoerder
- GRAPHENEA SEMICONDUCTOR SL
- MELLANOX TECHNOLOGIES LTD - MLNX
- BAR ILAN UNIVERSITY
- EXELIXIS DIACHEIRISI EREVNAS KAI EPIKOINONIA EE
Land(en)
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Vergelijkbare projecten uit andere regelingen
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Pre-commercialization of new generation Atomic-layer-deposited Lasers for future green high-performance data centersThis project aims to develop a low-cost, scalable silicon photonics fabrication technology to enhance energy efficiency in hyperscale data centers while meeting increasing bandwidth demands. | ERC Proof of... | € 150.000 | 2023 | Details |
Investigation of Disruptive 2D/Silicon Technology for Hybrid Multispectral PhotodetectionThe project aims to develop a unified platform for high-performance, broadband multispectral photodetectors using 2D materials and silicon technology for diverse applications. | ERC Starting... | € 1.998.750 | 2022 | Details |
Wafer Scale Ultra-Clean Van der Waals Heterostructures
This project aims to develop a novel inorganic transfer technique for wafer-scale two-dimensional materials, enhancing their quality and enabling industrial applications in electronics and optoelectronics.
Automated Transfer of Graphene
Dit project richt zich op het verbeteren en automatiseren van de overdracht van graphene naar 200 mm wafers, met als doel minimale schade en contaminatie voor een betrouwbare productie in de halfgeleiderindustrie.
Integrated photonic circuit fabrication by femtosecond laser writing for quantum information
The PhotonFAB project aims to enhance the production of integrated photonic devices for quantum applications using femtosecond laser writing, targeting commercial viability and market expansion.
Pre-commercialization of new generation Atomic-layer-deposited Lasers for future green high-performance data centers
This project aims to develop a low-cost, scalable silicon photonics fabrication technology to enhance energy efficiency in hyperscale data centers while meeting increasing bandwidth demands.
Investigation of Disruptive 2D/Silicon Technology for Hybrid Multispectral Photodetection
The project aims to develop a unified platform for high-performance, broadband multispectral photodetectors using 2D materials and silicon technology for diverse applications.