Tuning Heat Transport in 2D Materials with Defects

HeaT2Defects aims to enhance thermal management in miniaturized electronics by developing advanced imaging techniques to study defect influence on heat transport in 2D materials.

Subsidie
€ 1.500.000
2025

Projectdetails

Introduction

The unstoppable race towards miniaturization is pushing the limits of electronics. This has to be reconciled with the inevitable Joule heating that affects all electronic devices, ultimately compromising miniaturization itself, as denser circuits require improved thermal management.

Importance of Heat Transport

Understanding and eventually controlling heat transport at the nanometer scale will lay the foundation for the design of present and future electronics. The use of complex architectures and new nanomaterials, such as two-dimensional (2D) materials, holds great potential.

At such scales, atomic-scale defects, which are present everywhere in nature, play a fundamental role. Just a single defect can greatly impact the properties of materials. However, our knowledge of the influence of an individual defect on heat propagation is surprisingly scarce. This is partly due to the limited spatial resolution of state-of-the-art thermal imaging.

Project Goals

HeaT2Defects aims to explore the fundamental properties of matter at a much smaller scale than is currently possible. The project will focus on engineering the influence of defects (namely vacancies, ripples, and unconventional stacking) on heat transport of 2D devices.

Methodology

To this end, hinging on my extensive experience in scanning probe microscopy, I will develop an imaging technique with pioneering advances based on:

  1. Atomic force microscopy (AFM)
  2. Raman spectroscopy
  3. Nanoheater engineering

The versatility and resolution of AFM, combined with the thermal capabilities of Raman, will allow thermal mapping with nanometer precision, improving state-of-the-art resolution by one order of magnitude.

Expected Outcomes

This will enable a deep understanding of the influence of defects on heat transport and ultimately the engineering of the striking properties of 2D materials as thermal management components. This is vital to avoid energy waste and device malfunction.

Far-reaching implications are expected, both from the profound impact of heat transport in many scenarios and from the technological developments.

Financiële details & Tijdlijn

Financiële details

Subsidiebedrag€ 1.500.000
Totale projectbegroting€ 1.500.000

Tijdlijn

Startdatum1-1-2025
Einddatum31-12-2029
Subsidiejaar2025

Partners & Locaties

Projectpartners

  • UNIVERSIDAD AUTONOMA DE MADRIDpenvoerder

Land(en)

Spain

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