igzO-based smaRt Interposer technologieS fOr iNtegrated circuits and pixels
ORISON aims to create a scalable Si CMOS toolbox for ultra-low power, high-voltage interfacing, and compact 3D stacked hybrid pixel engines to enhance IoT and AR/VR applications.
Projectdetails
Introduction
Silicon complementary metal-oxide semiconductor (Si CMOS) technologies are ubiquitous in a plethora of products today employing a multitude of chips. The current challenges of Si chips research and applications are area, power consumption, and high-voltage interposing for AR/VR, low-power IoT, high-voltage sensors, and actuator interfaces such as MEMS and lab-on-chip.
Project Goals
ORISON’s goal is to develop a scalable toolbox on top of Si CMOS chip technologies for disruptive research activities in:
- Ultralow power circuit design
- High-voltage interfacing
- Low-area 3D stacked hybrid pixel engines
The technology platform focuses on a 3D hetero-integration route of Si CMOS and Indium-Gallium-Zinc-Oxide (IGZO) n-type transistors with a 100x lower electron mobility. The game-changing nature of ORISON enables innovation on three major pillars:
- Extreme low off-stage leakage currents due to the wide bandgap semiconductor, leading to ultralow power and long retention electronic circuits.
- The absence of a bulk for IGZO devices, enabling low footprint and high-voltage devices on top of Si CMOS.
- A 3D technology platform facilitating beyond state-of-the-art circuit and pixel resolutions.
Hybrid Cell Library Development
A new hybrid Si pMOS/IGZO cell library will be pioneered targeting ultra-low power consumption because of:
- Comparable sub-threshold slopes of both technologies
- Low off-state leakage currents
- Individual tunable threshold voltages by a local backgate
In addition, true cell-level power gating techniques are envisioned to radically reduce idle power consumption, paving the way to lifetime battery-powered or battery-less wearables and leaf-node IoT.
Impact on Applications
The novel high-voltage hybrid library positively impacts MEMS and AR/VR applications with unprecedented footprint and power characteristics and enables technology partitioning for smart pixels. The 3D technology also envisions high-resolution pixel engines with refresh-on-demand capacitor-less pixel engines.
Financiële details & Tijdlijn
Financiële details
Subsidiebedrag | € 1.999.688 |
Totale projectbegroting | € 1.999.688 |
Tijdlijn
Startdatum | 1-5-2023 |
Einddatum | 30-4-2028 |
Subsidiejaar | 2023 |
Partners & Locaties
Projectpartners
- KATHOLIEKE UNIVERSITEIT LEUVENpenvoerder
Land(en)
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