Far-infrared semiconductor electronics
Projectdetails
Introduction
The project will establish frontline semiconductor terahertz electronics for far-infrared space instruments by exploring and combining InP-based semiconductors with thin silicon membrane technology. The goal is to obtain high receiver sensitivity and stability for much less power consumption beyond what is currently considered state-of-the-art in the 2-5 THz frequency range.
Terahertz Measurements
Terahertz measurements of the atmosphere are made routinely to monitor and reveal physical and chemical processes related to weather and climate change. New space initiatives, using constellations of terahertz receivers on small satellites, can help to gain further data and insights about the climate system.
Need for Advanced Receivers
For atmosphere science, there is a need for a terahertz receiver without active cryogenic cooling that can operate over a broad ambient temperature range with sufficient sensitivity and can make observations over a long time.
Challenges in Supra-Terahertz Band
For the supra-terahertz band (>3 THz), several challenges, such as power consumption and inefficient coupling to the terahertz radiation, leave a gap in semiconductor technology. Hence, future Earth and space science missions need new compact heterodyne receiver solutions with improved energy conversion efficiency.
Current Solutions and Limitations
Millimeter wave, antenna-integrated, InP-based Schottky barrier mixers have shown high sensitivity at a small cost in power consumption (local oscillator). Still, InP substrates are fragile and not suitable for supra-terahertz circuits.
Proposed Approach
Therefore, combining robust, integrated silicon membrane technology with InP-based electronics can potentially revolutionize future space terahertz instrumentation. This approach will enable compact, efficient, and advanced room-temperature heterodyne receivers for far-infrared space science instruments and trigger future research on terahertz electronics in various applications.
Financiële details & Tijdlijn
Financiële details
Subsidiebedrag | € 2.499.828 |
Totale projectbegroting | € 2.499.828 |
Tijdlijn
Startdatum | 1-10-2024 |
Einddatum | 30-9-2029 |
Subsidiejaar | 2024 |
Partners & Locaties
Projectpartners
- CHALMERS TEKNISKA HOGSKOLA ABpenvoerder
Land(en)
Vergelijkbare projecten binnen European Research Council
Project | Regeling | Bedrag | Jaar | Actie |
---|---|---|---|---|
Chip-based room-temperature terahertz frequency comb spectrometersThis project aims to develop a chip-based, room-temperature THz spectroscopy system using mid-infrared laser frequency combs for enhanced imaging and sensing applications. | ERC Starting... | € 1.499.995 | 2023 | Details |
Superconducting Parametric Amplifier Receiver Technology for Astronomy and Fundamental Physics ExperimentsThis project aims to develop ultra-broadband superconducting parametric amplifiers and frequency converters to revolutionize mm/sub-mm/THz instrumentation across various scientific and technological fields. | ERC Consolid... | € 2.999.974 | 2025 | Details |
Engineering QUAntum materials for TErahertz applicationsThis project aims to leverage the ultrafast thermodynamic properties of quantum materials to develop advanced THz technologies, enhancing performance and capabilities in the terahertz regime. | ERC Consolid... | € 1.999.233 | 2024 | Details |
Towards On-Chip Plasmonic Amplifiers of THz RadiationTERAPLASM aims to develop on-chip plasmonics amplifiers for THz radiation using innovative 2D materials and geometries, enhancing applications in telecommunications and biosensing. | ERC Advanced... | € 2.499.999 | 2023 | Details |
Photonic Spectrum Analyzer for the Terahertz Spectral DomainPhoSTer THz aims to develop affordable photonic spectrum analyzers for the Terahertz range to enhance component development for 6G and other applications, overcoming limitations of current electronic systems. | ERC Proof of... | € 150.000 | 2022 | Details |
Chip-based room-temperature terahertz frequency comb spectrometers
This project aims to develop a chip-based, room-temperature THz spectroscopy system using mid-infrared laser frequency combs for enhanced imaging and sensing applications.
Superconducting Parametric Amplifier Receiver Technology for Astronomy and Fundamental Physics Experiments
This project aims to develop ultra-broadband superconducting parametric amplifiers and frequency converters to revolutionize mm/sub-mm/THz instrumentation across various scientific and technological fields.
Engineering QUAntum materials for TErahertz applications
This project aims to leverage the ultrafast thermodynamic properties of quantum materials to develop advanced THz technologies, enhancing performance and capabilities in the terahertz regime.
Towards On-Chip Plasmonic Amplifiers of THz Radiation
TERAPLASM aims to develop on-chip plasmonics amplifiers for THz radiation using innovative 2D materials and geometries, enhancing applications in telecommunications and biosensing.
Photonic Spectrum Analyzer for the Terahertz Spectral Domain
PhoSTer THz aims to develop affordable photonic spectrum analyzers for the Terahertz range to enhance component development for 6G and other applications, overcoming limitations of current electronic systems.
Vergelijkbare projecten uit andere regelingen
Project | Regeling | Bedrag | Jaar | Actie |
---|---|---|---|---|
UNIVERSAL SENSOR BASED ON ELECTRICALLY-PUMPED MID-INFRARED SPECTROMETER ON SILICON CHIPSUNISON aims to develop a compact, high-performance mid-IR spectroscopy platform for detecting greenhouse and toxic gases, enabling widespread use in IoT applications. | EIC Pathfinder | € 2.998.045 | 2024 | Details |
Solid-State Cooling Technology for Cryogenic DevicesDeveloping a compact, fully electrical solid-state refrigerator to achieve sub-kelvin temperatures for advanced electronics and photonics, eliminating the need for 3He and heavy magnets. | EIC Transition | € 1.298.411 | 2023 | Details |
Nano-scale Development of Plasmonic Amplifiers Based on 2D MaterialsThis project aims to develop efficient THz wave amplifiers using surface plasmons in novel 2D materials to bridge the THz source gap and enhance THz technology applications. | EIC Pathfinder | € 2.999.191 | 2023 | Details |
Phase-sensitive Alteration of Light colorAtioN in quadri-parTIte gaRnet cavItyPALANTIRI aims to develop an efficient on-chip analog coherent frequency converter to enhance internet connectivity and enable a quantum-ready infrastructure using advanced hybridization techniques. | EIC Pathfinder | € 3.303.533 | 2022 | Details |
NanoElectroMechanical Infrared Light for Industrial and Environmental SensingDeveloping the NEMILIE uncooled IR sensor to achieve market readiness, offering high sensitivity at room temperature for diverse applications without the need for cryogenic cooling. | EIC Transition | € 2.223.128 | 2022 | Details |
UNIVERSAL SENSOR BASED ON ELECTRICALLY-PUMPED MID-INFRARED SPECTROMETER ON SILICON CHIPS
UNISON aims to develop a compact, high-performance mid-IR spectroscopy platform for detecting greenhouse and toxic gases, enabling widespread use in IoT applications.
Solid-State Cooling Technology for Cryogenic Devices
Developing a compact, fully electrical solid-state refrigerator to achieve sub-kelvin temperatures for advanced electronics and photonics, eliminating the need for 3He and heavy magnets.
Nano-scale Development of Plasmonic Amplifiers Based on 2D Materials
This project aims to develop efficient THz wave amplifiers using surface plasmons in novel 2D materials to bridge the THz source gap and enhance THz technology applications.
Phase-sensitive Alteration of Light colorAtioN in quadri-parTIte gaRnet cavIty
PALANTIRI aims to develop an efficient on-chip analog coherent frequency converter to enhance internet connectivity and enable a quantum-ready infrastructure using advanced hybridization techniques.
NanoElectroMechanical Infrared Light for Industrial and Environmental Sensing
Developing the NEMILIE uncooled IR sensor to achieve market readiness, offering high sensitivity at room temperature for diverse applications without the need for cryogenic cooling.