SubsidieMeestersSecure and Efficient Chipset for Uninterrupted Reliable Connectivity in Europe
Last Mile Semiconductor is developing a low-cost, ultra-low-power wireless chipset for IoT that combines 5G and Bluetooth efficiency, enabling long-range connectivity and supporting Europe's digital sovereignty and sustainability.
Projectdetails
Introduction
Last Mile Semiconductor (LMS) is revolutionizing IoT connectivity with our innovative, low-cost, ultra-low-power wireless chipset.
Technology Overview
Combining the high performance of cellular 5G networks with the efficiency of Bluetooth, our chipset operates on the new non-cellular 5G DECT NR+ standard.
Key Features
- Long-range connectivity up to 6 km
- Data rates up to 10 Mbps
- Ultra-low latency without the need for middle operators
Collaboration and Development
Developed in collaboration with industry leaders and tailored to the needs of our customers, our chipset is set to transform the European IoT landscape.
Commitment to Sustainability
With an emphasis on digital sovereignty and environmental sustainability, our solution supports the massive deployment of IoT and contributes to Europe's economic growth.
Financiële details & Tijdlijn
Financiële details
| Subsidiebedrag | € 2.493.313 |
| Totale projectbegroting | € 2.493.313 |
Tijdlijn
| Startdatum | 1-12-2024 |
| Einddatum | 30-11-2026 |
| Subsidiejaar | 2024 |
Partners & Locaties
Projectpartners
- LAST MILE SEMICONDUCTOR GMBHpenvoerder
Land(en)
Vergelijkbare projecten binnen EIC Accelerator
| Project | Regeling | Bedrag | Jaar | Actie |
|---|---|---|---|---|
Leading the way to energy autonomous edge computingDeveloping ultra-low power semiconductor technologies to create an integrated IoT platform that harnesses ambient energy, reducing battery reliance and environmental impact. | EIC Accelerator | € 2.500.000 | 2023 | Details |
Scaling Minima ultra-low energy computing technology to make intelligent wireless devices energy efficientMinima develops ultra-low energy microprocessors to enhance the efficiency of wireless devices, aiming to transform the €6.3 billion semiconductor market by 2035. | EIC Accelerator | € 2.448.250 | 2022 | Details |
A cutting-edge digital dispensing system for next-gen electronics manufacturingThe io600 system revolutionizes semiconductor packaging with eco-friendly, high-resolution material deposition, enabling smaller, more powerful chips and supporting sustainability in the industry. | EIC Accelerator | € 2.457.875 | 2024 | Details |
Intelligent power management integrated circuits for a greener, more efficient Internet of ThingsDeveloping an Intelligent Power-Management Integrated Circuit (IPMIC) to reduce energy consumption in IoT devices by 50-99%, enhancing performance and sustainability while minimizing battery reliance. | EIC Accelerator | € 2.486.750 | 2024 | Details |
Ultra-High Speed memories for unprecedented cloud-computing performanceXenergic aims to revolutionize SRAM design for IoT and high-performance applications, achieving up to 90% energy savings and 3x speed, while seeking EIC Accelerator investment for market readiness. | EIC Accelerator | € 2.499.999 | 2022 | Details |
Leading the way to energy autonomous edge computing
Developing ultra-low power semiconductor technologies to create an integrated IoT platform that harnesses ambient energy, reducing battery reliance and environmental impact.
Scaling Minima ultra-low energy computing technology to make intelligent wireless devices energy efficient
Minima develops ultra-low energy microprocessors to enhance the efficiency of wireless devices, aiming to transform the €6.3 billion semiconductor market by 2035.
A cutting-edge digital dispensing system for next-gen electronics manufacturing
The io600 system revolutionizes semiconductor packaging with eco-friendly, high-resolution material deposition, enabling smaller, more powerful chips and supporting sustainability in the industry.
Intelligent power management integrated circuits for a greener, more efficient Internet of Things
Developing an Intelligent Power-Management Integrated Circuit (IPMIC) to reduce energy consumption in IoT devices by 50-99%, enhancing performance and sustainability while minimizing battery reliance.
Ultra-High Speed memories for unprecedented cloud-computing performance
Xenergic aims to revolutionize SRAM design for IoT and high-performance applications, achieving up to 90% energy savings and 3x speed, while seeking EIC Accelerator investment for market readiness.
Vergelijkbare projecten uit andere regelingen
| Project | Regeling | Bedrag | Jaar | Actie |
|---|---|---|---|---|
5G op ZeeHet project richt zich op het integreren van satellietcommunicatie in 5G-NB-IoT om sensoren wereldwijd, ook buiten zendmastbereik, kosteneffectief en energiezuinig data te laten versturen. | Mkb-innovati... | € 19.440 | 2021 | Details |
LoRa4AllHet project ontwikkelt een betaalbare indoor LoRaWAN Gateway voor minder dan 20 EUR om de adoptie van LoRaWAN te versnellen. | Mkb-innovati... | € 20.000 | 2021 | Details |
Dispersion force masked-based helium atom lithographyThe FabouLACE project aims to develop a disruptive lithography technology using metastable atoms to achieve 2 nm chip features, enhancing performance and enabling new markets by 2031. | EIC Transition | € 2.499.397 | 2023 | Details |
InteroperabilityHet project ontwikkelt een generiek IoT-platform en gateway, in samenwerking met strategische partners, om apparaten te verbinden en processen te optimaliseren voor diverse sectoren. | Mkb-innovati... | € 106.955 | 2015 | Details |
JOUW INTERNET DING OP MAAT MET GESTANDAARDISEERDE INFRASTRUCTUUR SOFTWAREAlltrons B.V. onderzoekt de haalbaarheid van een softwareoplossing voor veilige dataverwerking van IoT-apparaten via LoRaWAN. | Mkb-innovati... | € 20.000 | 2024 | Details |
5G op Zee
Het project richt zich op het integreren van satellietcommunicatie in 5G-NB-IoT om sensoren wereldwijd, ook buiten zendmastbereik, kosteneffectief en energiezuinig data te laten versturen.
LoRa4All
Het project ontwikkelt een betaalbare indoor LoRaWAN Gateway voor minder dan 20 EUR om de adoptie van LoRaWAN te versnellen.
Dispersion force masked-based helium atom lithography
The FabouLACE project aims to develop a disruptive lithography technology using metastable atoms to achieve 2 nm chip features, enhancing performance and enabling new markets by 2031.
Interoperability
Het project ontwikkelt een generiek IoT-platform en gateway, in samenwerking met strategische partners, om apparaten te verbinden en processen te optimaliseren voor diverse sectoren.
JOUW INTERNET DING OP MAAT MET GESTANDAARDISEERDE INFRASTRUCTUUR SOFTWARE
Alltrons B.V. onderzoekt de haalbaarheid van een softwareoplossing voor veilige dataverwerking van IoT-apparaten via LoRaWAN.