SubsidieMeestersHighly Efficient and Lightweight Input/output Open Silicon
SiPearl aims to develop high-end microprocessors to enhance European chip sovereignty, supported by significant funding and partnerships, while advancing its HELIOS platform architecture.
Projectdetails
Introduction
SiPearl was spun off from the European Processor Initiative (EPI) with €7.4m of initial funding to develop high-end microprocessors and protect European chip sovereignty.
Partnerships and Achievements
In the past 2 years, SiPearl has:
- Partnered and contracted with Arm and other top-tier IP providers.
- Secured a €4.6M order book.
- Identified a €1.1Bn sales pipeline in Europe alone.
Current Funding Efforts
SiPearl is currently raising an €80M+ Series A. We are confident to close this round by year-end based on the achievements of the past 3 months:
- Lead term sheet from a lead corporate investor of our industry.
- €25M venture loan from the EIB.
- €15M follow-on grant from EPI.
- Additional LOIs from several corporate and public investors.
Hiring Plans
We are currently hiring 7-10 employees per month in Europe.
Funding Application
This funding application relates to an additional €2.5M EIC grant + €15M EIC equity, which is meant to support the development of our next generation HELIOS platform architecture. This architecture supports the new European Chips Act by reducing the cost and time of new chip designs.
Financiële details & Tijdlijn
Financiële details
| Subsidiebedrag | € 2.500.000 |
| Totale projectbegroting | € 3.582.500 |
Tijdlijn
| Startdatum | 1-7-2022 |
| Einddatum | 30-6-2025 |
| Subsidiejaar | 2022 |
Partners & Locaties
Projectpartners
- SIPEARLpenvoerder
- SIPEARL SL
- SIPEARL GMBH
Land(en)
Vergelijkbare projecten binnen EIC Accelerator
| Project | Regeling | Bedrag | Jaar | Actie |
|---|---|---|---|---|
Europe’s first unified and versatile processing platform architecture in 5nm technology with proven scalability from edge to central high-performance solutions with unmatched cost and power efficiencyvideantis aims to develop a scalable 5nm processor architecture for automotive and AI applications, enhancing European chip sovereignty and reducing costs for OEMs by up to 90%. | EIC Accelerator | € 2.499.999 | 2023 | Details |
Silicon-Rich Materials for Advanced Semiconductor FabricationThe project aims to develop advanced inorganic materials for Extreme Ultraviolet lithography to enhance semiconductor chip performance and capture a significant market share in photoresist materials. | EIC Accelerator | € 2.487.240 | 2023 | Details |
iSMILE - integrated scalable microLED enginesThe i'SMILE project aims to establish a European GaN cleanroom for microLED production, enabling integration of microelectronics with microphotonics and fostering local innovation in AR technology. | EIC Accelerator | € 1.673.262 | 2024 | Details |
Solving the scaling challenge of the memory industry: high-speed, low-complexity and low-cost non-volatile ferroelectric memory (Fe-NVRAM) made in EUFMC aims to revolutionize the European semiconductor market by developing innovative, energy-efficient memory solutions, reducing reliance on imports and creating local jobs. | EIC Accelerator | € 2.499.999 | 2024 | Details |
A cutting-edge digital dispensing system for next-gen electronics manufacturingThe io600 system revolutionizes semiconductor packaging with eco-friendly, high-resolution material deposition, enabling smaller, more powerful chips and supporting sustainability in the industry. | EIC Accelerator | € 2.457.875 | 2024 | Details |
Europe’s first unified and versatile processing platform architecture in 5nm technology with proven scalability from edge to central high-performance solutions with unmatched cost and power efficiency
videantis aims to develop a scalable 5nm processor architecture for automotive and AI applications, enhancing European chip sovereignty and reducing costs for OEMs by up to 90%.
Silicon-Rich Materials for Advanced Semiconductor Fabrication
The project aims to develop advanced inorganic materials for Extreme Ultraviolet lithography to enhance semiconductor chip performance and capture a significant market share in photoresist materials.
iSMILE - integrated scalable microLED engines
The i'SMILE project aims to establish a European GaN cleanroom for microLED production, enabling integration of microelectronics with microphotonics and fostering local innovation in AR technology.
Solving the scaling challenge of the memory industry: high-speed, low-complexity and low-cost non-volatile ferroelectric memory (Fe-NVRAM) made in EU
FMC aims to revolutionize the European semiconductor market by developing innovative, energy-efficient memory solutions, reducing reliance on imports and creating local jobs.
A cutting-edge digital dispensing system for next-gen electronics manufacturing
The io600 system revolutionizes semiconductor packaging with eco-friendly, high-resolution material deposition, enabling smaller, more powerful chips and supporting sustainability in the industry.
Vergelijkbare projecten uit andere regelingen
| Project | Regeling | Bedrag | Jaar | Actie |
|---|---|---|---|---|
ENABLING NEW QUANTUM FRONTIERS WITH SPIN ACOUSTICS IN SILICONThis project aims to develop a scalable silicon-based quantum information platform by enhancing qubit control, readout, and coupling mechanisms, fostering collaboration across Europe for advanced quantum computing. | EIC Pathfinder | € 3.235.322 | 2025 | Details |
Ultralow power ferroelectric spintronic components for logic and artificial intelligenceUPSPRING aims to revolutionize microelectronics by advancing ultra-low energy FESO technology to reduce chip energy consumption by 1000x, enhancing performance and supporting EU semiconductor sovereignty. | EIC Transition | € 2.499.999 | 2025 | Details |
Security SealMpicoSys ontwikkelt elektronische beveiligingszegels voor objecten, gericht op fraudebestrijding en marktvalidatie. | Mkb-innovati... | € 20.000 | 2020 | Details |
Developing Multi-Core Silicon-Based Quantum ProcessorsThe project aims to develop a scalable FDSOI-based quantum processor demonstrator with a 4X4 multi-core architecture to bridge the gap between semiconductor techniques and quantum computing needs. | EIC Transition | € 2.440.870 | 2024 | Details |
Inline Photonics Visual Inspection TesterSettels onderzoekt de haalbaarheid van een inline testmachine voor photonic integrated circuits om de kwaliteit en productiecapaciteit te verbeteren. | Mkb-innovati... | € 20.000 | 2021 | Details |
ENABLING NEW QUANTUM FRONTIERS WITH SPIN ACOUSTICS IN SILICON
This project aims to develop a scalable silicon-based quantum information platform by enhancing qubit control, readout, and coupling mechanisms, fostering collaboration across Europe for advanced quantum computing.
Ultralow power ferroelectric spintronic components for logic and artificial intelligence
UPSPRING aims to revolutionize microelectronics by advancing ultra-low energy FESO technology to reduce chip energy consumption by 1000x, enhancing performance and supporting EU semiconductor sovereignty.
Security Seal
MpicoSys ontwikkelt elektronische beveiligingszegels voor objecten, gericht op fraudebestrijding en marktvalidatie.
Developing Multi-Core Silicon-Based Quantum Processors
The project aims to develop a scalable FDSOI-based quantum processor demonstrator with a 4X4 multi-core architecture to bridge the gap between semiconductor techniques and quantum computing needs.
Inline Photonics Visual Inspection Tester
Settels onderzoekt de haalbaarheid van een inline testmachine voor photonic integrated circuits om de kwaliteit en productiecapaciteit te verbeteren.