High mobilitY Printed nEtwoRks of 2D Semiconductors for advanced electrONICs

Introduction

Future technological innovations in areas such as the Internet of Things and wearable electronics require cheap, easily deformable, and reasonably performing printed electronic circuitries. However, current state-of-the-art (SoA) printed electronic devices show mobilities of ~10 cm²/Vs, about 100 times lower than traditional Si-electronics.

Challenges in Printed Electronics

A promising solution to print devices from 2D semiconducting nanosheets gives relatively low mobilities (~0.1 cm²/Vs) due to the rate-limiting nature of charge transfer (CT) across inter-nanosheet junctions. By minimizing the junction resistance ( R_J ), the mobility of printed devices could match that of individual nanosheets, i.e., up to 1000 cm²/Vs for phosphorene, competing with Si.

Project Overview: HYPERSONIC

HYPERSONIC is a high-risk, high-gain interdisciplinary project exploiting new chemical and physical approaches to minimize ( R_J ) in printed nanosheet networks, leading to ultra-cheap printed devices with a performance 10¹⁰ beyond the SoA.

Chemical Approach

The chemical approach relies on chemical crosslinking of nanosheets with (semi)conducting molecules to boost inter-nanosheet CT.

Physical Approach

The physical approach involves synthesizing high-aspect-ratio nanosheets, leading to low bending rigidity and increased inter-nanosheet interactions, yielding conformal, large-area junctions of >10⁴ nm² to dramatically reduce ( R_J ).

Technology Goals

Our radical new technology will use a range of n- or p-type nanosheets to achieve printed networks with mobilities of up to 1000 cm²/Vs. A comprehensive electrical characterization of all nanosheet networks will allow us to:

1. Identify those with ultra-high mobility.
2. Fully control the relation between basic physics/chemistry and network mobility.

Demonstration of Utility

We will demonstrate the utility of our technology by using our best-performing networks as complementary field-effect devices in next-generation, integrated, wearable sensor arrays. Printed digital and analog circuits will read and amplify sensor signals, demonstrating a potential commercializable application.