Mycelium-based substrate for sustainable flexible PCBs

MycoSub aims to develop biodegradable mycelium-based flexible circuit boards that integrate into existing manufacturing processes, promoting sustainability in electronics.

Subsidie
€ 150.000
2024

Projectdetails

Introduction

Printed circuit boards are an indispensable technology present in all classes of modern electronics. Their flexible embodiments (flexPCBs) enable current and emerging form factors and drive the transition to human-centered applications.

Environmental Impact

At the same time, PCBs are notoriously difficult to recycle and contribute majorly to the growth of electronic waste and an unsustainable use of resources. A paradigm change towards bioderived and biodegradable materials promises a remedy; however, so far, no viable solution for sustainable (flex)PCBs exists.

Innovative Approach

MycoSub takes on an entirely new approach of growing and refining fungal mycelium skins as environmentally friendly and entirely biodegradable, yet high-performance substrate material for the manufacturing of flexPCBs.

Development Goals

Building upon MycelioTronics, the first mycelium-based electronic circuits, we aim at developing an industry-compatible process flow that seamlessly merges into established commercial procedures for rapid adoption of the technology.

Key Features

With facile post-processing steps that do not impede biodegradability, we will achieve a competitive flexible circuit board substrate with:

  • High thermal stability
  • High flexibility
  • Low surface roughness

Manufacturing Techniques

We aim to develop both conventional subtractive (etching) as well as fully sustainable additive manufacturing techniques for low-conductivity, soldering-compatible conducting traces.

Sustainability Objectives

Such MycoSub-flexPCBs will ultimately provide unprecedented levels of sustainability through the combination of:

  1. A biodegradable yet resilient substrate
  2. Efficient waste-minimizing workflows
  3. Energy-saving strategies
  4. Re-use strategies for precious metals and electronic components

Material Characterization

These endeavors will be accompanied by thorough material characterization, ensuring that MycoSub materials live up to the high requirements of the industry.

Conclusion

Ultimately, MycoSub-flexPCB demoboards will showcase the potential of sustainable solutions for the broad ecosystem of flexible electronics.

Financiële details & Tijdlijn

Financiële details

Subsidiebedrag€ 150.000
Totale projectbegroting€ 150.000

Tijdlijn

Startdatum1-2-2024
Einddatum31-7-2025
Subsidiejaar2024

Partners & Locaties

Projectpartners

  • UNIVERSITAT LINZpenvoerder

Land(en)

Austria

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