DYnamically MANaged self-cooling HPC Data Centers

Introduction

DYMAN targets the development of a completely new design of adsorption chillers based on the following innovations:

1. New Low-Temperature Adsorbents
   Achieving high capacities at very low driving temperatures below 50 °C.

2. New Type of Adsorption Heat Exchangers
   Made of 3D printed structures integrating the adsorption material into a porous structure. This innovation reduces the internal thermal resistances and improves heat transfer by two-phase flow, enhancing the heat transfer rate and reducing the internal electricity consumption of the unit.

Core Concepts

Additionally, the project aims to develop a second core concept to further develop an existing two-phase cooling system for high-performance computing servers. This system is designed to handle thermal loads more efficiently from next-generation processors.

Goals

The goals include:

• Increasing cooling capacities for processors generating high heat fluxes, such as the Nvidia H100 chip, which produces 70 W/cm².
• Recovering 50% of waste heat from processors to generate additional cooling power through a sorption heat pump.

Integration of Cooling Methods

Combining two-phase cooling directly with heat-powered cooling could significantly improve efficiency over conventional air or water-based cooling methods alone. The objectives here are:

1. Further develop the present two-phase cooling system to work efficiently in combination with the sorption heat pump (concept 1).
2. Development of a new evaporator with advanced surfaces for high heat transfer coefficients.
3. Development of a new condenser integrated with the heat adsorber of the sorption heat pump. This is a crucial component that can improve the efficiency of the whole integrated system to recover up to 50% of rejected heat.

Data Center Management

Furthermore, the cooling data center management is a complex engineering system with interactions with different components of the data centers. Therefore, DYMAN proposes a new way of active management of the data center, integrating the cooling system as part of the optimization of processor management.