Industrial Selective PLAting for Solar Heterojunction

The iSPLASH project aims to revolutionize HJT cell metallisation by using cost-effective copper deposition technology, reducing costs by 90% and eliminating silver to lower carbon emissions.

Subsidie
€ 2.449.440
2022

Projectdetails

Introduction

Despite the boom in the photovoltaics industry, there are still barriers to solar cell deployment. Costly and cumbersome manufacturing processes emitting high levels of GHG are a major hindrance.

Metallisation Challenges

A key step in cell manufacture is metallisation, representing over 30% of the cost of manufacture. Currently, heterojunction (HJT) cell metallisation utilises silver paste, which has major disadvantages in terms of cost, efficiency, and environmental impact.

Alternative Solutions

Alternative metals, such as copper, can overcome these challenges; however, efficient process technology has not yet been brought to market.

Project Overview

The iSPLASH project will cause a paradigm shift in HJT cell metallisation. Our technology will be the only processing technology on the market to cost-effectively exploit the low price of copper and facilitate the reliable and precise fine line deposition of copper onto HJT cells, completely eliminating the use of silver.

Impact

iSPLASH technology will reduce metallisation costs by 90% and carbon emissions.

Financiële details & Tijdlijn

Financiële details

Subsidiebedrag€ 2.449.440
Totale projectbegroting€ 3.499.200

Tijdlijn

Startdatum1-10-2022
Einddatum31-5-2025
Subsidiejaar2022

Partners & Locaties

Projectpartners

  • RISE TECHNOLOGY SRLpenvoerder

Land(en)

Italy

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